2015 International Conference on Simulation of
Semiconductor Processes and Devices (SISPAD)
Full Paper Submission


University of Maryland






CoolCAD Electronics, LLC




Micron Technology




Technical Sponsor:

IEEE, Technical Sponsor


Aerial View of the National Mall and the Smithsonian Institution Museums, Washington DC

Washington Monument, Washington, DC

Old Post Office Pavilion, by Mike Peel, www.mikepeel.net

Conference Information

The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of the leading-edge research and development results in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.

The 20th SISPAD conference will be held on September 9-11, 2015.

Location: Hyatt Regency Washington on Capitol Hill, 400 New Jersey Avenue NW, 20001, Washington DC, USA. Minutes on foot from downtown Washington DC and the National Mall. Click here to register with the SISPAD 2015 rates.

Final Paper Submission Deadline EXTENDED: July 20, 2015. Full paper submissions are now open.

Notification Letters: Notification letters were sent on June 10, 2015. If you have not received your letter, please contact sispad@umd.edu .

Conference Registration: Registration is now open. Please visit the registration page.

Paper Topics

Original papers will be presented in the following subject areas:

  1. Ab Initio and Density Functional Theory
  2. Compact Models
  3. Device Modeling and Simulation
  4. Electronic Transport in Semiconductor Materials and Devices
  5. New Algorithms for Process and Device Modeling
  6. Process and Equipment Modeling and Simulation
  7. Physical-Level Circuit Simulation
  8. Radio Frequency Devices
  9. Simulation of Nano- and Quantum Devices
  10. Simulation of Novel Device Structures
  11. Simulation of Photovoltaics and Other Green Technologies
  12. Simulation of Power Devices
  13. Simulation of Photonic Devices, Sensors, Biosensors and Electromechanical Systems
  14. User Interfaces and Visualization


SISPAD is held annually, with the location circulating among Asia, Europe, and the USA. For information on previous SISPAD conferences, please visit: http://www.sispad.org/.