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Remotely Powered Arrays of Active

Strain-Gauge Wall Sensors

(Funded by the NSF, Grant# 0132266)

 

 
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  Project Summary  

Project Summary

We work on a design theory for wireless systems that monitor the condition of remotely powered, possible embedded, strain gauge smart sensors, as for example, may be used for determining the reinforced concrete walls or transportation bridges.

This research is to move the field of remote wireless technology into the field of material damage and health assessment. The results would be of considerable practical importance since they would allow for the remote evaluation of things, such as earthquake damage or age fatigue, without the risk of loss of human lives. It also provides a way of constantly monitoring the health of bridges, detecting damages before they can cause serious results, such as collapse.

These preliminary investigations will involve determining the power handling capabilities of a chip consisting of active analog VLSI transistorized bridge circuits which determine the state of the strain gauges. Strain gauges will be used and will serve as one arm in the active bridge which will be sent to mosis for fabrication into a VLSI chip. The attenuation characteristics of structural materials, such as reinforced concrete are also to be determined as well as a means of transmitting data into and out of the embedded bridge. As a preliminary proof of concept the remote system will be mounted on the exterior of a wall whereas longer range studies will incorporate it embedded inside of walls. 

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Project Progress


First Year Tasks Status Comment
Layout of a VLSI bridge chip Completed  
Testing for determining characteristics of concrete Completed Reinforced concrete dielectric properties is still  under study.
Converting RF power into DC bias power Under study  
Design of surface receiver Under study  
Design of surface transmitter Under study  
Passive powered sensing system Under study  
Embedded strain gauges Under study  

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Results

Under construction. 

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Project Participants

  • Professor Robert W. Newcomb      PI  
  • Professor Amde M. Amde           Co-PI  
  • Professor K. J. Ray Liu          Co-PI 
  • Professor Kawthar A. Zaki        Co-PI 
  • Ms. Yu Jiang                     G.R.A. 
  • Mr. Ming Wang                    G.R.A. 
  • Ms. Azadeh Davoodi               G.R.A. 
  • Mr. Juventino Rosas              MS student 
  • Mr. Antimmario J. Jackson        BS student under summer ASPIRE Resarch Scholarship Program  
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Contact Information

  • Mailing Address: 

  • Deptartment of Electrical and Computer Engineering 
    University of Maryland 
    College Park, MD 20742 USA
  • Professor Robert W. Newcomb                   newcomb@eng.umd.edu 
  • Professor, Civil Eng., Amde M. Amde                   amde@eng.umd.edu 
  • Professor K. J. Ray Liu                     kjrliu@eng.umd.edu 
  • Professor Kawthar A. Zaki                        zaki@eng.umd.edu 
  • Ms. Yu Jiang                                  jiangyu@glue.umd.edu 
  • Mr. Ming Wang                                   wming@glue.umd.edu 
  • Ms. Azadeh Davoodi                             azade@Glue.umd.edu 
  • Mr. Juventino Rosas                           jrosas@Glue.umd.edu 
  • Mr. Antimmario J. Jackson                           ajjacks@Glue.umd.edu 
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Microsystems Laboratory, University of Maryland

 
     
 

 

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  Lastest update: 03/13/2002