Zeynep Dilli, Publications

Three-Dimensional Integration

• Dilli, Z., Goldsman, N., Akturk, A., and Metze, G., "A 3-D time-dependent Green's Function approach to modeling electromagnetic noise in on-chip interconnect networks," presented in International Conf. on Semiconductor Processes and Devices (SISPAD) 2006, pp.337-340, Monterey, CA, Sep. 2006.
• Dilli, Z., Goldsman, N., and Akturk, A., "An impulse-response based methodology for modeling complex interconnect networks," presented in International Semiconductor Device Research Symposium (ISDRS) 2005, pp. 64-65, Bethesda, MD, Dec. 2005.

• Dilli, Z., Akturk, A., Goldsman, N., and Metze, G., "Controlled On-Chip Heat Transfer for Directed Heating and Temperature Reduction", Solid State Electronics, v. 53, no. 6, pp. 590-598, June 2009, doi 10.1016/j.sse.2009.03.023 .
• Akturk, A., Allnutt, J., Dilli, Z., Goldsman, N. and Peckerar, M., "Device modeling at Cryogenic Temperatures: Effects of incomplete ionization," IEEE Transactions on Electron Devices, v. 54, no. 11, pp. 2984-2990, Nov. 2007.
• Dilli, Z., Akturk, A., and Goldsman, N., "Controlled localized heating on integrated circuits for cold-ambient temperature applications," presented in International Semiconductor Device Research Symposium (ISDRS) 2007, College Park, MD, Dec. 2007.
• Akturk, A., Goldsman, N., Dilli, Z., Peckerar, M., "Effects of cryogenic temperatures on small-signal MOSFET capacitances," presented in International Semiconductor Device Research Symposium (ISDRS) 2007, College Park, MD, Dec. 2007.
• Akturk, A., Goldsman, N., Dilli, Z., Peckerar, M. "Device performance and package induced self heating effect at cryogenic temperatures," presented in International Conf. on Semiconductor Processes and Devices (SISPAD) 2006, pp.240-243, Monterey, CA, Sep. 2006.
• Anderson, G., Kim, J., Goldsman, N. and Dilli, Z., "Invetigating pool boiling using a novel temperature distribution sensor," presented in ECI International Conference on Boiling Heat Transfer, May 2006.

• Bai, Y., Dilli, Z., Goldsman, N. and Metze, G., "Frequency-dependent modeling of on-chip inductors on lossy substrates," presented in International Semiconductor Device Research Symposium (ISDRS) 2003, Washington DC, Dec. 2003.

• Dilli, Z. and Goldsman, N., "Relating electrical and computer engineering to the high school classroom," presented in International Semiconductor Device Research Symposium (ISDRS) 2007, College Park, MD, Dec. 2007.
• Dilli, Z. and Goldsman, N., "Development and implementation of a multi-specalty advanced capstone design course," presented in Information Technology Based Higher Education and Training (ITHET) 2004, pp. 425-428, Jun. 2004.
• Dilli, Z., Goldsman, N., Schmidt, J.A., Harper, L and Marcus, S.L., "A new pedagogy in electrical and computer engineering: An experiential and conceptual approach," presented in Frontiers in Education (FIE) 2002, v. 1, pp.T2C-3-7, Boston, MA, Nov. 2002. This paper was awarded the Benjamin Dasher Conference Paper Award.
• Goldsman, N. and Dilli, Z. An Experiential Introduction to Electrical and Computer Engineering, University of Maryland, College Park, 2001.

• Ngu, Y., Peckerar, M., Dilli, Z. and Goldsman, N., "High capacitance battery for powering distributed networks node devices," presented in International Semiconductor Device Research Symposium (ISDRS) 2007, College Park, MD, Dec. 2007.
• Peckerar, M., Ngu, Y., Dilli, Z., Shen, C-C., Salter, T., Bhattacharyya, S., Goldsman, N., "Integrated multi-layer design of ad-hoc smart small sensor networks," 33rd Annual GOMACTech Conference, invited talk, Las Vegas, NV, Mar. 2008.

• Saini, S.S., Johnson, F.G., Dilli, Z., Hu, Y., Grover, R., Stone, D.R., Shen, P., Pamulapati, J., Zhou, W. and Dagenais, M., "Compact low-loss vertical resonant mode coupling between two well-confined waveguides," Electronics Letters, v. 35, no. 14, pp. 1145-1147, Jul. 1999.
• Saini, S.S., Hu, Y., Dilli, Z., Grover, R., Dagenais, M., Johnson, F.G., Stone, D.R., Shen, H., Zhou, W. and Pamulapati, J., "Integrated 1x2 loss-less Y-junction splitter on a passive active resonant coupler platform," presented in Lasers and Electro-Optics (CLEO) 2000, pp. 423-424, May 2000.
• Saini, S.S., Dilli, Z., Hu, Y., Grover, R., Dagenais, M., Johnson, F.G., Stone, D.R., Shen, H., Pamulapati, J. and Zhou, W., "Compact low-loss vertical resonant mode coupling between two well-confined waveguides for monolithic integration," presented in Lasers and Electro-Optics Society 12^th Annual Meeting (LEOS) 1999, v. 2, pp.840-841, Nov. 1999.
• Dagenais, M., Saini, S.S., Vusirikala, V., Bartolo, R.E., Whaley, R.D., Dilli, Z., Hu, Y., Fan, Z.F., Johnson, F.G., Shen, P.H., Pamulapati, J., Zhou, W. "Alignment-tolerant Structures for Ease of Optoelectronic Packaging," Proceedings of the SPIE, v. 2636, Packaging and Testing of Semiconductor Lasers II, p. 128, Jan. 1999.
• Dagenais, M., Saini, S.S., Dilli, Z., Johnson, F.G., Stone, D.R., Shen, H., Zhou, W. "Taper Length Variation in Passive Active Resonant Coupler (PARC) Platform," in Integrated Photonics Research, ed. T.Li, V. 45 of OSA Trends in Optics and Photonics (OSA, 2000), p. IThG3, Quebec, Ca., July 12, 2000.
• Saini, S.S., Dilli, Z., Dagenais, M., Johnson, F.G., Stone, D., Shen, H., Pamulapati, J., "Passive/active Resonant Coupler (PARC) Platform With Tapered Passive Waveguide," Proc. SPIE, v. 2087, p.254, in Applications of Photonic Technology 4, Quebec City, Canada, Jun. 2000.

• Peckerar, M., Goldsman, N., Ngu, Y., Dilli, Z., Metze, G. "A Flexible, High Specific-Energy Density, Rechargeable Battery." Provisional Patent filed with the UMD Office of Technology Commercialization, March 2008.