Clark School Home UMD
ECE

ECE News Story

Srivastava & Bar-Cohen Deliver Tutorial at SEMI-THERM29

Srivastava & Bar-Cohen Deliver Tutorial at SEMI-THERM29

Associate Professor Ankur Srivastava (ECE/ISR) and Professor Avram Bar-Cohen (Mechanical Engineering) held an evening tutorial on March 19 at the 29th Annual IEEE Thermal Measurement, Modeling and Management Symposium (SEMI-THERM29). The tutorial addressed “Microfluidic Thermal Management and Thermal-Electronic Co-Design for Chip Stacks.” The symposium was held in San Jose, CA. The focus of SEMI-THERM is to provide an annual forum for the exchange of latest technical developments in thermal management of electronic devices, components and systems. This is accomplished by providing a multifaceted program of events of interest to developers, practitioners and researchers from academia and industry. The symposium is dedicated to providing an informal atmosphere, which highlights the latest advances in the field.

Their evening tutorial focused on three-dimensional chip stacking, which is poised to become the next packaging paradigm in the electronic industry. While this paradigm provides significant improvements in device density, interconnect delays, and system integration, it can be expected to lead to higher heat densities and decreased access to chip hot spots and surfaces. Intrachip and interchip microfluidic cooling, with low boiling point, inert, dielectric liquids, is a most promising thermal management technique for this packaging paradigm, but aggressive thermal-electronic co-design is needed to achieve improved performance and energy efficiency. The tutorial presented a brief review of the emerging 3D form factors, application of microfluidic cooling, a codesign heuristic, and a Case Study exploring the benefits of co-optimization of micro-channel allocation and thermal TSV planning on chip stack performance.

The program for SEMI-THERM29 included four days of presentations, keynote addresses, workshops, and courses dedicated to thermal management and innovation that would keep today’s technology cool and operating optimally.

Related Articles:
Shi and Srivastava win 2012 ISVLSI Best Paper Award
Alumnus Tassiulas Wins 2016 IEEE Kobayashi Award
Wu Wins 2015 Signal Processing Society Meritorious Service Award
Alumnus Forte Accepts Position at University of Florida
Liu Awarded 2016 IEEE Kirchmayer Graduate Teaching Award
Workshop on Geometry of Collective Behavior organized by P. S. Krishnaprasad
ECE Professor Wins IEEE SPS Society Award
Liu Elected to IEEE Board of Directors
Ephremides Wins IEEE MILCOM Lifetime Acheivement Award
ECE Student Emmeline Zhu Selected as 2013-14 IEEE PES Scholarship Plus Scholar

March 22, 2013


Prev   Next

Current Headlines

UMD Prof T.M. Antonsen Jr. Recognized by IEEE for Contributions to Vacuum Electronics

Rubloff, Ghodssi to speak at TechConnect World Innovation Conference and Expo

Ephremides and colleagues issued U.S. Patent 9,318,232

UMD Inventors Zoom In on New Camera Technology 

Ulukus Named 2016-2017 Distinguished Scholar-Teacher by University of Maryland

PH.D. student Thomas Winkler awarded Ann G. Wylie Dissertation Fellowship

Alumna Rose Faghih Named a 2016 New Faces of Engineering Honoree

Alumnus Radha Poovendran is PI for cybersecurity MURI grant

News Resources

Return to Newsroom

Search News

Archived News

Events Resources

Events Calendar

Additional Resources

UM Newsdesk

Faculty Experts