ENEE 605 (719R): Design and Fabrication of Micro-Electro-Mechanical Systems (MEMS)
The goals of this course are to explore the world of Micro-Electro-Mechanical Systems (MEMS) by understanding its design and fabrication aspects. More specifically, students learn that MEMS are sensors and actuators that are designed using different areas of engineering disciplines and they are constructed using a microlithographically-based manufacturing process in conjunction with both semiconductor and micromachining microfabrication technologies. Different examples of MEMS designs and fabrication technologies would be studied that are currently employed in a wide range of devices, including microaccelerometers for crash detection in vehicles, pressure sensors for implantable medical devices, arrays of miniature mirrors for projection displays, and systems for chemical detection and assay. The results of homework, case studies and course project will prove the benefits of MEMS devices, which include small size, low power consumption, ease of integration into arrays, potential for monolithic integration with electronics, and low cost in high volume.
ENEE 312 or equivalent.
It is desirable that students have an awareness of some of the following: material properties, fabrication technologies, basic structural mechanics, sensing and actuation principles, circuit and system issues, packaging, calibration and test. Some of this material will be reviewed as deemed necessary, through a combination of lectures, case studies, individual homework assignments and design projects carried out in teams.
It is desirable that students have an awareness of some of the following: material properties, fabrication technologies, basic structural mechanics, sensing and actuation principles, circuit and system issues, packaging, calibration and test. Some of this material will be reviewed as deemed necessary, through a combination of lectures, case studies, individual homework assignments and design projects carried out in teams.
Textbook(s)
There is no standard textbook. We will use a combination of (a) selections from texts and reference books (see list below), (b) lecture notes generated for this subject, and (c) notes from both MIT and UW-Madison equivalent MEMS courses. In addition, students are expected to use (d) UMD libraries for books, journals, and conference proceedings, and (e) on line information services to support homework and project assignments.Books and Monographs (will be on reserve at the Engineering Library Desk):
- Julian W. Gardner, Microsensors: Principles and Applications, Wiley, 1994.
- L. Ristic, Editor, Sensor Technology and Devices, Artech House, 1994.
- D. S. Ballantine, et. al., Acoustic Wave Sensors, Academic Press, 1997.
IEEE Reprint Books:
- James M. Gere and Stephen P. Timoshenko, Mechanics of Materials, 2nd Edition, Brooks/Cole Engineering Division, 1984.
- S. D. Senturia, Design of Microelectromechancial Devices and Systems, will be published in summer 2000.
- R. S. Muller, et. al., Editors, Microsensors, IEEE Press, 1991.
Journals:
- W. Trimmer, Editor, Micromechanics and MEMS, IEEE Press, 1997.
- J. Microelectromechanical Systems (IEEE/ASME).
- J. Micromechanics and Microengineering (IEEE) (available on line).
- Sensors and Actuators (Elsvier).
Major Conference Proceedings:
- Sensors and Materials (MY, Japan – in English).
Web Sites:
- Transducers ‘XX (International Conference on Solid-State Sensors and Actuators), odd numbered years since 1983, proceeding available from IEEE (US Meetings), Elsevier (European Meetings), IEE (Japanese Meetings).
- MEMS ‘XX (IEEE Workshop on Micro Electro Mechanical Systems), annual since 1989.
- Eurosensors ‘XX, annual since 1987, proceedings published in special issues of Sensors and Actuators.
- ISI MEMS Archive: http://mems.isi.edu/mems – the primary web site in the field.
- DARPA/ETO MEMS Program: http://eto.sysplan.com/ETO/MEMS/index.html – DoD view of MEMS, including descriptions of active projects.
- M-Test: http://www-mtl.mit.edu/MEMCAD/mtest.html – MATLAB scripts needed for homework.
- SciCentral: http://www.scicentral.com/ – links to many information sources.
Core Topics:
- Introduction: An overview of microelectromechanical devices and technologies.
- Material Properties: Definitions of mechanical, thermal, electrical, magnetic, optical, and chemical properties of materials. A library assignment to locate information on material properties accompanies this unit.
- Fabrication Technology: Brief review of standard microelectronic fabrication technologies; detailed discussion of bulk micromachining, surface micromachining, bonding technologies, LIGA technology and related fabrication methods. Assignments will emphasize the relation between process and mask specifications and the resulting device geometry, and also the effect of etch selectivity on process viability.
- Mechanical Behavior: Introduction to static behavior of elementary beams, membranes, and plates; effects of residual stress and stress gradients; dynamic and normal modes; damping.
- Sensing of Position and Strain: Use of capacitive, inductive, optical, piezoresistive, and piezoelectric methods for sensing.
- Pressure Sensors and Accelerometers: Case studies based on MEMS literature.
- Resonant Sensors and Drive Circuits: Principles of resonant sensors and how resonators interact with drive electronics; case study of rate gyroscopes.
- System Issues: System partitioning; drive and sense circuits; feedback stability; noise, packaging.
- Case Studies: While students are working on final projects, a series of four lectures covering fluidic microsystems, optical MEMS devices, biochemical analysis microsystems, and power MEMS devices such as turbines and generators.
Course Structure:
The plan is for seven individual homework assignments, usually requiring some independent work either in the library and/or with modeling, plus a final design project done in teams of four students. A preliminary presentation and report of the final design project is due half way through the semester and the final design project presentation and report will occur during the last week of the semester (before the final exams!).Grading Method:
Approximately 50% on homework and 50% on the project that consists of two segments: (1) preliminary project presentation and report and (2) final project presentation and report.
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