ENEE 719R: Advanced Topics in Microelectronics: Design and Fabrication
of Micro-Electro-Mechanical Systems (MEMS)
Course Goals:
The goals of this course are to explore the world of Micro-Electro-Mechanical
Systems (MEMS) by understanding its design and fabrication aspects. More
specifically, students learn that MEMS are sensors and actuators that are
designed using different areas of engineering disciplines and they are
constructed using a microlithographically-based manufacturing process in
conjunction with both semiconductor and micromachining microfabrication
technologies. Different examples of MEMS designs and fabrication technologies
would be studied that are currently employed in a wide range of devices,
including microaccelerometers for crash detection in vehicles, pressure
sensors for implantable medical devices, arrays of miniature mirrors for
projection displays, and systems for chemical detection and assay. The
results of homework, case studies and course project will prove the benefits
of MEMS devices, which include small size, low power consumption, ease
of integration into arrays, potential for monolithic integration with electronics,
and low cost in high volume.
Course Prerequisite(s):
ENEE 312 or equivalent.
It is desirable that students have an awareness of some of the following:
material properties, fabrication technologies, basic structural mechanics,
sensing and actuation principles, circuit and system issues, packaging,
calibration and test. Some of this material will be reviewed as deemed
necessary, through a combination of lectures, case studies, individual
homework assignments and design projects carried out in teams.
Topics Prerequisite(s):
It is desirable that students have an awareness of some of the following:
material properties, fabrication technologies, basic structural mechanics,
sensing and actuation principles, circuit and system issues, packaging,
calibration and test. Some of this material will be reviewed as deemed
necessary, through a combination of lectures, case studies, individual
homework assignments and design projects carried out in teams.
Textbook(s)
There is no standard textbook. We will use a combination of (a) selections
from texts and reference books (see list below), (b) lecture notes generated
for this subject, and (c) notes from both MIT and UW-Madison equivalent
MEMS courses. In addition, students are expected to use (d) UMD libraries
for books, journals, and conference proceedings, and (e) on line information
services to support homework and project assignments.
Books and Monographs (will be on reserve at the Engineering Library
Desk):
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Julian W. Gardner, Microsensors: Principles and Applications, Wiley,
1994.
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D. S. Ballantine, et. al., Acoustic Wave Sensors, Academic Press,
1997.
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James M. Gere and Stephen P. Timoshenko, Mechanics of Materials,
2nd Edition, Brooks/Cole Engineering Division, 1984.
IEEE Reprint Books:
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S. D. Senturia, Design of Microelectromechancial Devices and Systems, will
be published in summer 2000.
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R. S. Muller, et. al., Editors, Microsensors, IEEE Press, 1991.
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W. Trimmer, Editor, Micromechanics and MEMS, IEEE Press, 1997.
Journals:
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J. Microelectromechanical Systems (IEEE/ASME).
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J. Micromechanics and Microengineering (IEEE) (available on line).
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Sensors and Actuators (Elsvier).
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Sensors and Materials (MY, Japan – in English).
Major Conference Proceedings:
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Transducers ‘XX (International Conference on Solid-State Sensors and Actuators),
odd numbered years since 1983, proceeding available from IEEE (US Meetings),
Elsevier (European Meetings), IEE (Japanese Meetings).
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MEMS ‘XX (IEEE Workshop on Micro Electro Mechanical Systems), annual since
1989.
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Eurosensors ‘XX, annual since 1987, proceedings published in special issues
of Sensors and Actuators.
Web Sites:
Core Topics:
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Introduction: An overview of microelectromechanical devices and
technologies.
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Material Properties: Definitions of mechanical, thermal, electrical,
magnetic, optical, and chemical properties of materials. A library assignment
to locate information on material properties accompanies this unit.
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Fabrication Technology: Brief review of standard microelectronic
fabrication technologies; detailed discussion of bulk micromachining, surface
micromachining, bonding technologies, LIGA technology and related fabrication
methods. Assignments will emphasize the relation between process and mask
specifications and the resulting device geometry, and also the effect of
etch selectivity on process viability.
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Mechanical Behavior: Introduction to static behavior of elementary
beams, membranes, and plates; effects of residual stress and stress gradients;
dynamic and normal modes; damping.
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Sensing of Position and Strain: Use of capacitive, inductive, optical,
piezoresistive, and piezoelectric methods for sensing.
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Pressure Sensors and Accelerometers: Case studies based on MEMS
literature.
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Resonant Sensors and Drive Circuits: Principles of resonant sensors
and how resonators interact with drive electronics; case study of rate
gyroscopes.
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System Issues: System partitioning; drive and sense circuits; feedback
stability; noise, packaging.
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Case Studies: While students are working on final projects, a series
of four lectures covering fluidic microsystems, optical MEMS devices, biochemical
analysis microsystems, and power MEMS devices such as turbines and generators.
Course Structure:
The plan is for seven individual homework assignments, usually requiring
some independent work either in the library and/or with modeling, plus
a final design project done in teams of four students. A preliminary presentation
and report of the final design project is due half way through the semester
and the final design project presentation and report will occur during
the last week of the semester (before the final exams!).
Grading Method:
Approximately 50% on homework and 50% on the project that consists of
two segments: (1) preliminary project presentation and report and (2) final
project presentation and report.
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